FH-730 copper-tin plating agent
FH-730 Copper-Tin Plating Agent: Technical Overview The FH-730 is a specialized copper-tin alloy plating agent designed for electroplating applications, offering a balanced combination of conductivity, corrosion resistance, and aesthetic appeal. This cyanide-free formulation is engineered to deposit a uniform copper-tin alloy layer on various substrates, including steel, zinc alloys, and plastics (with prior metallization). Its optimized chemistry ensures stable performance across industrial environments while adhering to modern environmental and safety standards. Key Features 1. Composition & Mechanism The FH-730 operates as an alkaline bath, typically containing copper salts, stannate compounds, and proprietary complexing agents. The system maintains a controlled ratio of copper (Cu) to tin (Sn), usually between 70:30 and 80:20, yielding a dense, low-porosity deposit. The plating process involves cathodic reduction, where Cu²⁺ and Sn⁴⁺ ions co-deposit under precise current density (0.5–3 A/dm²) and temperature (50–65°C) conditions. 2. Performance Advantages - Uniform Deposition: The agent produces a smooth, semi-bright to bright finish with minimal nodulation, suitable for decorative and functional applications. - Adhesion & Durability: Excellent bonding strength to base materials, coupled with high resistance to oxidation and wear. - Wide Current Density Window: Tolerant to operational variations, ensuring consistent results even with complex geometries. - Low Maintenance: Stable bath life with reduced sludge formation, aided by buffering additives and metal stabilizers. 3. Applications FH-730 is widely used in: - Electronics: EMI shielding, connector coatings, and PCB edge connectors due to its solderability and electrical conductivity. - Automotive: Decorative trims and underhood components requiring corrosion protection. - Hardware: Coatings for locks, hinges, and bathroom fixtures where aesthetics and tarnish resistance are critical. 4. Environmental & Safety Compliance The formulation avoids cyanides and heavy metals like cadmium, aligning with RoHS and REACH regulations. Waste treatment is simplified by the absence of toxic complexes. 5. Process Control Optimal performance requires monitoring pH (10–12), metal concentration, and bath temperature. Regular filtration and anode maintenance (e.g., using copper-tin anodes) prevent contamination. Conclusion The FH-730 copper-tin plating agent offers a reliable, eco-conscious solution for industries seeking a versatile alloy coating. Its balance of technical performance and operational ease makes it a preferred choice for functional and decorative plating needs.
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FH-730 Barrel Plating Lead-Free Nickel-Free White Copper-Tin – Eco-Friendly Electroplating Solution
Category： Environmentally friendly nickel-free black nickel gun black processBrowse number： 428Number：Release time： 2025-09-10 08:59:42The FH-730 Barrel Plating Lead-Free Nickel-Free White Copper-Tin solution is an advanced electroplating additive developed by Shenzhen Xinfuhua Surface Technology Co., Ltd., a professional manufacturer and research enterprise specializing in high-performance electroplating chemicals since 2005.
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FH-730 Barrel Plating Lead-Free Nickel-Free White Copper-Tin – Eco-Friendly Electroplating Solution
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