In Electroplating Processes, surface preparation is critical to achieving durable and high-performance coatings. Copper and copper alloys often require effective pretreatment to remove oxidation, scratches, and other surface defects.
The FH-66 Copper Alloy Chemical Polishing Agent provides a uniform, mirror-like surface finish by chemically dissolving microscopic roughness and contaminants. Unlike mechanical polishing, FH-66 achieves polishing at a microscopic level, offering higher efficiency, better consistency, and reduced labor intensity.
Developed with advanced electroplating additive technology, FH-66 integrates international polishing formulations and complies with ISO9001:2004 quality standards. It ensures stable bath performance, easy operation, and excellent compatibility with subsequent electroplating processes.
High polishing efficiency – Rapidly removes oxides and contaminants from copper alloy surfaces.
Mirror-like finish – Produces a smooth, reflective, and uniform surface.
Improved adhesion – Provides a clean and active surface for stronger electroplated coatings.
Stable bath chemistry – Long-lasting performance with minimal decomposition.
Reduced defects – Eliminates pitting, streaks, and uneven surfaces before plating.
Easy operation – Compatible with standard pretreatment lines, requiring minimal adjustments.
Environmentally optimized – Formulated to reduce harmful emissions compared to traditional polishing Solutions.
Oxide removal – Efficiently removes copper oxide and tarnish layers.
Surface leveling – Smooths out micro-scratches and uneven textures.
Brightness enhancement – Provides a shiny surface, improving decorative and functional plating outcomes.
Electroplating pretreatment – Ensures superior adhesion and quality of subsequent coatings.
Corrosion Prevention – Prepares the substrate to resist defects during plating.
High-Quality Surface Preparation – Ensures consistent polishing results, critical for premium plating.
Enhanced Productivity – Faster polishing process reduces production cycle times.
Cost Efficiency – Prolonged bath life lowers chemical consumption and operating costs.
Strong Compatibility – Suitable for different copper alloys and electroplating lines.
Improved Plating Performance – Minimizes plating defects, blistering, and peeling.
Safer and Cleaner Process – Lower toxicity compared to conventional chemical polishing agents.
The FH-66 Copper Alloy Chemical Polishing Agent is widely applied in:
Electronics Industry: Pre-polishing of connectors, lead frames, and PCB copper layers.
Hardware Manufacturing: Surface treatment of copper alloy fasteners, tools, and decorative hardware.
Jewelry & Decorative Plating: Enhances brightness and finish of copper-based ornaments.
Automotive Components: Pretreatment of copper and brass parts for durable coatings.
Precision Engineering: Applied in medical devices, aerospace components, and fine instruments requiring flawless plating quality.
General Industrial Plating: For any copper alloy substrate needing superior pretreatment.
Q1: What is FH-66 mainly used for?
A1: FH-66 is used for chemical polishing of copper and copper alloy substrates before electroplating, ensuring smooth and bright surfaces.
Q2: Does FH-66 damage the base material?
A2: No, FH-66 is carefully formulated to polish copper alloys without excessive erosion or damage to the substrate.
Q3: How does FH-66 improve Electroplating Quality?
A3: By removing oxides and surface defects, FH-66 creates a clean and active surface that enhances plating adhesion and brightness.
Q4: Is FH-66 suitable for automated production lines?
A4: Yes, FH-66 is compatible with both manual and automated chemical polishing lines.
Q5: What safety precautions are needed?
A5: Standard chemical handling measures should be followed, including protective gloves, goggles, and adequate ventilation.
Q6: How long does the polishing bath last?
A6: FH-66 offers excellent bath stability and extended service life, reducing the need for frequent replacement.
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